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Phenyl trimethoxysilan
Trimethoxysilylbenzene

Countertype of Evonik CP 0330, Dynasylan 9165, DowCorning Z-6214， ShinEtsu KBM-103, Silquest A-153

Chemical Structure

Introduction

DP-810 organosilanes basic structure is RnSi(OR)4-n, wherein "R" is an alkyl, aryl, or other organofunctional group and "OR" is a methoxy, ethoxy, or acetoxy group.

DP-810 phenyl silanes are a group of phenyl-containing silicon compounds.

Typical Physical Properties

Chemical Name:	Phenyltrimethoxysilane
CAS No.:	2996-92-1
EINECS No.:	221-066-9
Empirical Formula:	C₉H₁₄O₃Si
Molecular Weight:	198.29
Boiling Point:	211°C [760mmHg]
Flash Point:	92°C
Color and Appearance:	Colorless transparent liquid
Density [25°C]:	1.064
Refractive Index [25°C]:	1.4734
Purity:	Min. 99.5% (A Grade) Min. 99.0% (B Grade) Min. 98.0% (C Grade)

Application

DP-810 is used to modify the suface of inorganic fillers such as wollastonite and aluminum trihydroxide. It makes the surface of these inorganic fillers more hydrophobic and thus increases their dispersability in mineral-filled polymers.

DP-810 is especially suited for polymers that are processed at elevated temperatures. DP-810 reduces the viscosity of the polymer melt.

In many sol-gel applications DP-810 is partially hydrolyzed to form a preproduct that can be further crosslinked using temperature.

DP-810 reacts faster with water than DP-811.

Packing：Net weight 200Kg steel drum